Technical Data

Burn-in, HAST and THB Board Specifications

Up to 14 layers .062" thickness
Up to 24 layers .150" thickness
Board Size 22.5" x 24" and smaller

Materials Nelco 4000-13

Polyimide
Isola 410
BT Resin

Pitch

Min .4 mm
SMT and Through Hole

Imaging

Min Line/Space .003/.0025
Surface Mt Pad .008
Layer to Layer Registration + 0.002

Lamination

Max Layers 40
Min/Max Thickness .002/.250
Overall Thickness + 5%
Bow & Twist .5%

Drill and Routing

Hole Location .004
Finished Hole Size .006
Tolerance (PTH) + .001 inches
Tolerance (NPTH) + .001 inches
Min Drill Size .006
Aspect Ratio 20:1
Min Pad to Hole (I/L) Finished Hole Size + .010 inches
Min Plane Relief
Finished Hole Size + .025 inches

Plating

Electroless Ni 100 micro inches
Immersion Au 3 - 5 micro inches
Copper .003 inches
Nickel .0003 - .0005 inches
Solder .0001-.001 inches
Max Gold 50 - 100 micro inches

Etch Factors

Inner Layer + .0005 inches
Outer Layer + .0005 inches
Controlled Imp + 5%

Solder Mask

Min Clearance .002 /side
Min Lay Down .002 inches
Most colors available

Nomenclature/Legend

Min Line .005 inches
Color White (other colors available on request)